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Intel, Odisha and 3DGS Sign $3.3 Billion Glass-Substrate Pact in Bhubaneswar
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economictimes.indiatimes.com
India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project
Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…
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thenextweb.com
Intel and 3DGS back a $3.3bn glass-substrate plant in India’s Odisha
Intel and 3D Glass Solutions have signed an MoU to build a $3.3bn advanced-packaging glass-substrate plant in Odisha, deepening India’s chip-manufacturing bet.
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channelnewsasia.com
Intel, 3DGS to set up $3.3 billion substrate plant in India's Odisha state
NEW DELHI, May 29 : U.S. chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state of Odisha, the…
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gadgetsnow.indiatimes.com
Intel, Odisha and 3DGS Sign $3.3 Billion Glass-Substrate Pact in Bhubaneswar
Your personal data will be processed and information from your device (cookies, unique identifiers and other device data) may be stored by, accessed by and shared with 231…
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Intel, 3DGS sign $3.3-billion Odisha semiconductor MoU
A significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions have signed a memorandum of…
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cryptobriefing.com
Intel and 3DGS to establish $3.3B substrate plant in India
Intel and 3DGS are investing $3.3 billion in an advanced substrate manufacturing plant in Odisha, India, creating 1,800 jobs over a 5-6 year buildout.