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Intel, Odisha and 3DGS Sign $3.3 Billion Glass-Substrate Pact in Bhubaneswar
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economictimes.indiatimes.com
India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project
Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…
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thenextweb.com
Intel and 3DGS back a $3.3bn glass-substrate plant in India’s Odisha
Intel and 3D Glass Solutions have signed an MoU to build a $3.3bn advanced-packaging glass-substrate plant in Odisha, deepening India’s chip-manufacturing bet.
