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Intel, 3DGS sign $3.3-billion Odisha semiconductor MoU

A significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions have signed a memorandum of understanding. This collaboration will establish a new facility in Bhubaneswar-Khurda, focusing on advanced packaging and glass core substrates.

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economictimes.indiatimes.com

thenextweb.com

channelnewsasia.com

gadgetsnow.indiatimes.com

cryptobriefing.com

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economictimes.indiatimes.com3 mesi fa

India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project

India's Odisha state signed a $3.3 bn tripartite MOU with Intel and 3D Glass Solutions to build an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar-Khurda region. The deal signals that global semiconductor players are now committing capital to India's supply chain, making it a credible alternative node for advanced packaging alongside Taiwan and South Korea — relevant for any tech org reassessing hardware sourcing resilience.

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Timeline cronologica

venerdì 29 maggio 2026·thehindubusinessline.com
India's semiconductor push gains momentum as Odisha signs chip technology MoU with Intel, 3DGS
Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production
venerdì 29 maggio 2026·economictimes.indiatimes.com
India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project
Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…

Intel, 3DGS sign $3.3-billion Odisha semiconductor MoU

Confronto fonti

India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project

Timeline cronologica

India's semiconductor push gains momentum as Odisha signs chip technology MoU with Intel, 3DGS

India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project

Intel and 3DGS back a $3.3bn glass-substrate plant in India’s Odisha

Intel joins hands with Odisha govt to boost India’s semiconductor ecosystem

Intel and 3DGS to establish $3.3B substrate plant in India

Intel, 3DGS to set up $3.3 billion substrate plant in India's Odisha state

Intel, Odisha and 3DGS Sign $3.3 Billion Glass-Substrate Pact in Bhubaneswar

Intel and 3DGS back a $3.3bn glass-substrate plant in India’s Odisha

Intel, 3DGS to set up $3.3 billion substrate plant in India's Odisha state

Intel joins hands with Odisha govt to boost India’s semiconductor ecosystem

Intel, Odisha and 3DGS Sign $3.3 Billion Glass-Substrate Pact in Bhubaneswar

Intel, 3DGS sign $3.3-billion Odisha semiconductor MoU

Intel and 3DGS to establish $3.3B substrate plant in India

Intel, 3DGS to set up $3.3 billion substrate plant in Odisha - The Economic Times