A significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions have signed a memorandum of understanding. This collaboration will establish a new facility in Bhubaneswar-Khurda, focusing on advanced packaging and glass core substrates.

Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production

Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…

Intel, Odisha government and 3DGS signed an MoU for a USD 3.3 billion semiconductor substrate manufacturing project in India.