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Intel joins hands with Odisha govt to boost India’s semiconductor ecosystem
Intel, Odisha government and 3DGS signed an MoU for a USD 3.3 billion semiconductor substrate manufacturing project in India.
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thehindubusinessline.com
India's semiconductor push gains momentum as Odisha signs chip technology MoU with Intel, 3DGS
Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production
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economictimes.indiatimes.com
India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project
Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…
