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Intel, 3DGS to set up $3.3 billion substrate plant in India's Odisha state
NEW DELHI, May 29 : U.S. chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state of Odisha, the Indian government said on Friday.Here are some details:• The project is expected to create more than 1,800 direct high-skilled
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thehindubusinessline.com
India's semiconductor push gains momentum as Odisha signs chip technology MoU with Intel, 3DGS
Ashwini Vaishnaw says latest pact will strengthen semiconductor ecosystem amid push for domestic chip production
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economictimes.indiatimes.com
India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project
Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3…
