India's semiconductor push gains momentum as Odisha signs chip technology MoU with Intel, 3DGS

India's semiconductor push gets major boost with $3.3 bn deal for new Odisha substrate project

India's Odisha state signed a $3.3 bn tripartite MOU with Intel and 3D Glass Solutions to build an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar-Khurda region. The deal signals that global semiconductor players are now committing capital to India's supply chain, making it a credible alternative node for advanced packaging alongside Taiwan and South Korea — relevant for any tech org reassessing hardware sourcing resilience.