Breakthrough ultra-low R DS ( on ) drift technology delivers higher efficiency, greater power density, and enhanced reliability for next-generation power systems.NEW DELHI , Aug. 5, 2026 /PRNewswire/ -- Para Light Electronics today announced the official launch of its ThermaFlat™ SiC MOSFET family (ThermaFlat™ I and ThermaFlat™ II), targeting a fundamental thermal challenge in next-generation high-power design. Powered by Para Light's Ultra-Low R DS ( on ) Drift Technology, the new semiconductor portfolio breaks through one of the industry's most persistent technical bottlenecks—delivering exceptional thermal stability, reduced conduction losses, and unmatched reliability across rapidly expanding electrification markets.Solving Power Electronics' Most Persistent BottleneckThe global transition toward electrification—driven by artificial intelligence (AI), high-performance computing (HPC), renewable energy, electric vehicles (EVs), and energy storage—is forcing power systems to deliver higher output within smaller, cooler, and more efficient footprints.Yet conventional silicon and SiC MOSFETs face a built-in constraint: temperature-dependent R DS ( on ) drift. As junction temperatures rise in standard devices, escalating on-resistance can trigger a costly cycle of higher conduction losses, excessive heat generation, and expanded cooling requirements, ultimately degrading system efficiency and long-term reliability, while potentially increasing thermal management costs.~8% Resistance Drift: Redefining Thermal StabilityPara Light's ThermaFlat™ technology directly redefines this thermal dynamic. Unlike standard SiC MOSFETs, ThermaFlat™ devices maintain virtually flat on-resistance across wide operating temperatures while sustaining exceptionally low switching losses.In benchmark testing of Para Light's 650 V, 21mΩ TO-247 device, R DS ( on ) changes by only approximately 8% as junction temperature swings from -25°C all the way to +125°C. By drastically outperforming conventional SiC temperature coefficients, this ultra-stable performance allows designers to preserve high efficiency under heavy load, simplify thermal management, boost power density, and reduce overall system costs without sacrificing reliability. The 1200 V ThermaFlat™ family applies a similar ultra-low temperature coefficient to mission-critical, high-power conversion architectures.ThermaFlat™ I & II: Architecture-Ready VersatilityTo support diverse design topologies, Para Light has structured the portfolio into two specialized series: