JCET Group, China’s top outsourced semiconductor assembly and test (OSAT) provider, is expanding its advanced chip packaging footprint with a major new facility in Shanghai’s Lingang Special Area.
The company, formally known as Jiangsu Changjiang Electronics Technology Co., Ltd, approved a capital increase of RMB 4.4 billion (roughly $600 million) on February 5, 2024, to fund the initiative.
What JCET is actually building
The new Automotive Electronics facility sits on a site spanning over 130,000 square meters, with factory space exceeding 200,000 square meters. Construction kicked off in August 2023, with the production line expected to be fully operational by the end of 2025. The plant launched production on March 10, 2026, according to company disclosures.
The facility is purpose-built to address surging demand for automotive-grade and robotics chip packaging. JCET is also pushing forward on next-generation packaging technologies, including 3D packaging and co-packaged optics (CPO) using silicon photonics, with samples expected to be validated by mid-2026.
