JCET Group is building a massive new plant in Shanghai's Lingang area for advanced automotive and AI chip packaging, backed by a RMB 4.4 billion capital

US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development.

JCET Group is building a massive new plant in Shanghai's Lingang area for advanced automotive and AI chip packaging, backed by a RMB 4.4 billion capital