MediaTek is no longer putting all its silicon eggs in one basket. The company is now using Intel’s EMIB (Embedded Multi-Die Interconnect Bridge) packaging technology alongside TSMC’s CoWoS and SoIC services for its AI ASIC and data center chip designs.
The move is a pragmatic response to a simple problem: TSMC’s advanced packaging capacity is stretched thin, and MediaTek needs options. When the world’s most important chip foundry is heavily allocated to high-volume clients like Nvidia, even a major customer has to get creative.
Why MediaTek is shopping around
MediaTek has deep roots in the Google TPU ecosystem, contributing to designs like the TPU 8t built on TSMC’s N3P process with CoWoS-S packaging. But relying solely on TSMC for packaging when supply is constrained is a vulnerability, not a strategy.
Intel’s EMIB takes a fundamentally different approach to connecting multiple chiplets inside a single package. Instead of using a large silicon interposer like CoWoS, EMIB embeds small bridge chips directly into the package substrate.
