DECISIONMAKING:
While the majority of chips still use TSMC’s CoWoS technology, the unnamed client potentially favored the cost and capacity benefits of Intel’s EMIB
By Lisa Wang
/ Staff Reporter
MediaTek Inc (聯發科) yesterday revealed that a data center client opted for Intel Corp’s advanced packaging technology to build an in-house customized artificial intelligence (AI) accelerator, marking the first adoption of the technology in MediaTek’s customized chip design portfolio.Mediatek did not disclose the customer’s name, but analysts said the company is designing a tensor process unit — an AI application-specific IC (ASIC) — for Google.The cloud services provider prefers Intel’s embedded multi-die interconnect bridge technology (EMIB) over the chip-on-wafer-on-substrate (CoWoS) technology offered by Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), given substantial cost savings and capacity availability, analysts said.
