A view of the headquarters of SK hynix Inc. in Icheon, southeast of Seoul, South Korea, 23 April 2026. Photo by YONHAP / EPA
May 26 (Asia Today) -- SK hynix has unveiled a new high-bandwidth memory (HBM) technology integrating cooling functions directly into the package, aiming to address rising heat issues in AI memory systems and strengthen its next-generation AI semiconductor competitiveness.
The company announced on Monday that it had developed "iHBM (Integrated HBM)," a technology designed to effectively control heat generated inside HBM packages. As HBM performance rapidly improves through higher stacking and faster speeds, thermal management has become increasingly critical for maintaining stable operations.
In particular, heat density in the D2D PHY section connecting HBM and GPUs has emerged as a major challenge in AI computing systems.
Conventional HBM structures dissipate heat externally through the core die, but iHBM applies "ICE (Integrated Cooling Elements)" within the D2D PHY region, where heat concentration is highest, creating a dedicated heat dissipation path.
