According to the new leaks, Intel is evaluating an enhanced version of its upcoming 14A process technology featuring a dual-side power delivery architecture as competition intensifies in the race toward next-generation semiconductor manufacturing.

Intel's 14A2 chip node targets 21nm interconnects with dual-sided power delivery, competing with TSMC's A14 and Samsung's SF2Z on converging 2028-2029

Intel starebbe valutando una revisione del processo produttivo 14A chiamata 14A2. Secondo le fonti, la nuova versione introdurrebbe un'architettura di alimentazione dual-side per…