Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging - The Economic Times

Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will lead advanced packaging and system integration efforts, a crucial area for Intel's push into next-generation AI systems. His extensive experience in high-scale technology and manufacturing is expected to bolster Intel's capabilities and customer commitments in this vital segment of the semiconductor industry.

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