Intel Corp.
(NASDAQ:INTC) has appointed former SK Hynix and SK On chief executive Seok-Hee Lee as executive vice president of its contract chip-manufacturing business.
Intel Strengthens Advanced Packaging Strategy In a statement, Intel said Lee will report directly to CEO Lip-Bu Tan and oversee advanced packaging, system integration, back-end technology development and back-end manufacturing.
"Lee will lead all advanced packaging, system integration, back-end technology development and back-end manufacturing," the company said.
Intel Splits Manufacturing Leadership Roles As part of the restructuring, Intel said Executive Vice President Naga Chandrasekaran will concentrate on front-end technology development and manufacturing, with a focus on accelerating production of the company's 18A, 14A and future process technologies.
