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Storia: Intel taps Seok-Hee Lee to lead foundry packaging initiative — Warptech Lab News

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Storia in 9 fonti

Intel taps Seok-Hee Lee to lead foundry packaging initiative

Intel appoints former SK hynix CEO Seok-Hee Lee as EVP of Intel Foundry to lead advanced packaging, EMIB-T, and HBI development under CEO Lip-Bu Tan.

Raccontata da

newsroom.intel.com

cryptobriefing.com

channelnewsasia.com

economictimes.indiatimes.com

koreaherald.com

tomshardware.com

valor.globo.com

Confronto fonti

6 prospettive sulla stessa storia

AI · summaries

cryptobriefing.comStai leggendo2 mesi fa

Intel taps Seok-Hee Lee to lead foundry packaging initiative

Intel appoints former SK hynix CEO Seok-Hee Lee as EVP of Intel Foundry to lead advanced packaging, EMIB-T, and HBI development under CEO Lip-Bu Tan.

Timeline cronologica

giovedì 18 giugno 2026·newsroom.intel.com
Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Your source for all news Intel
giovedì 18 giugno 2026·cryptobriefing.com
Intel appoints former SK Hynix CEO Seok-Hee Lee as EVP of foundry
Intel names former SK Hynix CEO Seok-Hee Lee as EVP of Intel Foundry, adding a semiconductor veteran to its leadership as the company pushes its foundry

tomshardware.com

2 mesi fa

Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company…

Intel carves back-end packaging into a standalone business.

Leggi questa versione → originale

channelnewsasia.com2 mesi fa

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

June 18 : Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens focus on its advanced packaging business.The American chipmaker has been trying to…

Leggi questa versione → originale

newsroom.intel.com2 mesi fa

Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing

Your source for all news Intel

Leggi questa versione → originale

koreaherald.com2 mesi fa

Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging

Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced

Leggi questa versione → originale

economictimes.indiatimes.com2 mesi fa

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push - The Economic Times

The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing ‌out on ⁠the ⁠AI boom.

Leggi questa versione → originale

venerdì 19 giugno 2026·

channelnewsasia.com

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

June 18 : Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens focus on its advanced packaging business.The…

venerdì 19 giugno 2026·

benzinga.com

Intel Hires Former SK Hynix CEO Seok-Hee Lee To Lead Advanced Packaging Push As Apple Partnership Fuels F

Intel tapped former SK Hynix CEO Seok-Hee Lee to lead advanced packaging as it pushes to revive its foundry business.

venerdì 19 giugno 2026·

economictimes.indiatimes.com

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push - The Economic Times

The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing ‌out on ⁠the ⁠AI boom.

venerdì 19 giugno 2026·

hwupgrade.it

Intel rafforza la divisione Foundry: l'ex CEO di SK hynix per dominare nel packaging avanzato

Intel ha nominato Seok-Hee Lee, gi� CEO di SK hynix, nuovo Executive Vice President di Intel Foundry. Guider� packaging avanzato, integrazione di sistema e tecnologie di back-end.…

venerdì 19 giugno 2026·

cryptobriefing.com

Intel taps Seok-Hee Lee to lead foundry packaging initiative

Intel appoints former SK hynix CEO Seok-Hee Lee as EVP of Intel Foundry to lead advanced packaging, EMIB-T, and HBI development under CEO Lip-Bu Tan.

venerdì 19 giugno 2026·

koreaherald.com

Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging

Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced

venerdì 19 giugno 2026·

tomshardware.com

Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business…

Intel carves back-end packaging into a standalone business.

venerdì 19 giugno 2026·

valor.globo.com

Intel contrata ex-chefe da SK Hynix para impulsionar fabricação e empacotamento de chips

Empresa anunciou a nomeação de Lee Seok-Hee como vice-presidente executivo da Intel Foundry, sua divisão de fabricação de chips

sabato 20 giugno 2026·

economictimes.indiatimes.com

Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging - The Economic Times

Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will lead advanced packaging and system integration efforts,…