HomeAI · summaries
Storia in 9 fonti
Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced
Confronto fonti
6 prospettive sulla stessa storiaTimeline cronologica
- ·
newsroom.intel.com
Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Your source for all news Intel
- ·
cryptobriefing.com
Intel appoints former SK Hynix CEO Seok-Hee Lee as EVP of foundry
Intel names former SK Hynix CEO Seok-Hee Lee as EVP of Intel Foundry, adding a semiconductor veteran to its leadership as the company pushes its foundry
- ·
channelnewsasia.com
Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push
June 18 : Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens focus on its advanced packaging business.The…
- ·
benzinga.com
Intel Hires Former SK Hynix CEO Seok-Hee Lee To Lead Advanced Packaging Push As Apple Partnership Fuels F
Intel tapped former SK Hynix CEO Seok-Hee Lee to lead advanced packaging as it pushes to revive its foundry business.
- ·
economictimes.indiatimes.com
Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push - The Economic Times
The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing out on the AI boom.
- ·
hwupgrade.it
Intel rafforza la divisione Foundry: l'ex CEO di SK hynix per dominare nel packaging avanzato
Intel ha nominato Seok-Hee Lee, gi� CEO di SK hynix, nuovo Executive Vice President di Intel Foundry. Guider� packaging avanzato, integrazione di sistema e tecnologie di back-end.…
- ·
Intel taps Seok-Hee Lee to lead foundry packaging initiative
Intel appoints former SK hynix CEO Seok-Hee Lee as EVP of Intel Foundry to lead advanced packaging, EMIB-T, and HBI development under CEO Lip-Bu Tan.
- ·
koreaherald.com
Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced
- ·
tomshardware.com
Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business…
Intel carves back-end packaging into a standalone business.
- ·
valor.globo.com
Intel contrata ex-chefe da SK Hynix para impulsionar fabricação e empacotamento de chips
Empresa anunciou a nomeação de Lee Seok-Hee como vice-presidente executivo da Intel Foundry, sua divisão de fabricação de chips
- ·
Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging - The Economic Times
Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will lead advanced packaging and system integration efforts,…