Samsung Electronics shipped HBM4 AI memory chip samples globally, driving a 6% share surge as record profits and a $1 trillion market cap fuel its AI ambitions.

Micron and SK Hynix have joined Samsung in the trillion-dollar market cap club, driven by surging AI demand for high-bandwidth memory chips.

South Korea's SK Hynix and US chipmaker Micron both surpassed $1 trillion (€860bn) in market capitalisation within 24 hours of each other. Seoul's KOSPI index also hit an all-time…

Samsung, Micron, and SK Hynix each surpassed $1 trillion market cap in May 2026, driven by surging AI demand for high-bandwidth memory chips.

Agreement shows the latest impact of AI boom as two more chipmakers join $1tn club

The global AI boom has transformed the semiconductor industry, pushing Micron and SK Hynix past the $1 trillion market value mark. Surging demand for AI memory chips, supply…

SEOUL, May 29 : Samsung Electronics said on Friday it has started shipping samples of its latest high-bandwidth memory (HBM) chip, or the 12-layer HBM4E, marking what it said was…

Samsung Electronics said Friday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the world's first ship

Samsung Electronics said Friday it has begun supplying samples of the world's first 12-layer HBM4E chip to major customers, marking its latest push to gain grou

Samsung Electronics has begun shipping samples of its next-generation 12-layer high bandwidth memory (HBM), HBM4E, to customers.

Shares of Samsung Electronics surged after the company began shipping HBM4E chip samples to its customers globally.

Samsung Electronics shipped HBM4 AI memory chip samples globally, driving a 6% share surge as record profits and a $1 trillion market cap fuel its AI ambitions.

Samsung's stock jumped 6.51% after announcing the global shipment of its 12-layer HBM4E chip samples, boasting speeds of 16 Gbps with enhanced energy and thermal efficiency.

Just months after shipping HBM4, Samsung has announced that it has begun shipping HBM4E to partners to support "increasingly demanding next-generation AI workloads."

Samsung ships 12-layer HBM4E memory chip samples ahead of schedule, with 16 Gbps speeds and 4.0 TB/s bandwidth. Shares surge 6.5% as the AI memory race heats up.

Samsung ha iniziato a spedire i primi sample delle memorie HBM4E a 12 layer, evoluzione delle HBM4 dedicate ai sistemi AI. Le nuove soluzioni offrono velocit� fino a 16 Gbps,…

The HBM4E delivers speeds of up to 16 Gbps and 3.6 TB/s of memory bandwidth, a more than 20% improvement over its predecessor

Empresa afirmou que os chips HBM4E de 12 camadas representam melhoria de mais de 20% na velocidade de processamento de dados e um aumento de mais de 30% na capacidade em relação à…

Samsung Electronics manda muestras de chip HBM4E a clientes, adelantándose a sus competidores en la distribución de una nueva versión del producto.

Samsung Electronics said it shipped samples of its seventh-generation high-bandwidth memory chip, for the 1st time, demonstrating its competitiveness