Wolfspeed and LITEON are joining forces to develop 800 VDC power solutions purpose-built for AI data centers, with LITEON qualifying Wolfspeed’s silicon carbide technology for integration into high-efficiency power modules.
AI data centers running power-dense GPUs around the clock rely on power delivery systems where every conversion from one form to another wastes energy as heat. Traditional AC-based data center architectures involve several conversion steps between the utility grid and the chip doing the actual computation. An 800 VDC architecture dramatically reduces those conversion stages, meaning less waste, less heat, and lower operating costs.
NVIDIA launched its 800 VDC power architecture at Computex 2025, signaling to the industry that this wasn’t a theoretical exercise but rather the direction the entire ecosystem needed to move. LITEON demonstrated integrated 800 VDC solutions at NVIDIA’s GTC 2026 event, which ran from March 16 to 19, 2026. Those demonstrations included 110 kW power shelves and liquid-cooling solutions designed to work within NVIDIA’s architectural framework.
By qualifying Wolfspeed’s silicon carbide technology, LITEON is adding another performance layer to its power delivery stack. Silicon carbide, or SiC, is a wide-bandgap semiconductor material that handles high voltages and temperatures far better than traditional silicon.
