The race to power AI data centers just got a new contestant, and it’s not a hyperscaler. Power Integrations, the semiconductor company best known for making compact power conversion chips, pulled back the curtain on two ultra-slim auxiliary power supply reference designs at COMPUTEX in Taipei on June 1. The designs are built specifically for Nvidia’s 800 VDC Kyber architecture, the liquid-cooled blade-rack system that underpins the next generation of megawatt-scale AI infrastructure.
What Power Integrations actually built
The two reference designs are built on Power Integrations’ 1700 V PowiGaN gallium-nitride technology, a platform the company has been developing for high-voltage industrial and data center applications.
The first is a 15 W single-output model measuring 30 mm by 30 mm by 7 mm. The second is a more capable 35 W six-rail isolated design at 80 mm by 60 mm by 8 mm. Both designs achieve at least 88% efficiency across line and load conditions. They also deliver approximately 30% space savings on power distribution boards, along with a roughly 30% reduction in bill-of-materials costs on main power distribution boards.
Power Integrations has been working alongside Nvidia on 800 VDC architecture since at least 2025. The collaboration was referenced in a white paper on 1250 V and 1700 V PowiGaN technology, released at the OCP Global Summit on October 13, 2025.
