The funding will support next-generation photonics, optical materials and advanced packaging for AI infrastructure.
August 3, 2026
U.S. chipmaker GlobalFoundries has entered a letter of intent with the U.S. Department of Commerce, with the government agency set to award the company$300 million to support the development of silicon photonics.
The optical technology, which uses light rather than electrical signals for high-bandwidth, energy-efficient data transfers, is used to power AI data centers and has become an area of increased investment interest in recent years.
According to GF, the funding will support development of next-generation silicon photonics wafer technologies, novel optical materials and advanced packaging, including its 3D hybrid bonding technology.
