Micron Technology now expects its first wafer output from the new Idaho fabrication plant by mid-2027, slightly ahead of prior guidance that pointed to the second half of the year. The update, delivered during the company’s investor event on May 22, represents a modest but meaningful acceleration for what has become one of the largest semiconductor construction projects on American soil.
What Micron is actually building
The Idaho expansion is the centerpiece of Micron’s $50 billion manufacturing initiative, which spans facilities in Boise, New York, and Virginia. Each of the two planned Idaho fabs will house approximately 600,000 square feet of cleanroom space, dedicated to producing leading-edge DRAM chips.
Equipment move-in at the first Idaho facility is slated for later in 2026, setting the stage for that mid-2027 production target. Ground preparation for the second Idaho fab is already underway.
The second Idaho fab is expected to come online before Micron’s first New York facility. The project is projected to create around 90,000 direct and indirect jobs across US sites over the next two decades.
