Micron Technology is pushing forward with one of the largest semiconductor investments in US history, and the timeline is actually ahead of schedule.
The company’s megafab project in Clay, Onondaga County, New York, represents a planned investment of up to $100 billion over two decades. On June 10, 2026, Micron appointed Bechtel as the engineering, procurement, and construction partner for the facility’s first phase, marking the transition from site preparation into active construction.
What’s actually happening on the ground
Micron held its official groundbreaking ceremony on January 16, 2026. By late May, initial ground preparation activities were already running ahead of schedule.
The first wafer output from the New York facility is expected around 2030.
