At COMPUTEX 2026, YPlasma Unveils the First Fanless Solid-State Cooling Solution for NVIDIA Jetson, Built for 24/7 Edge AI Workloads
PR Newswire
NEWARK, N.J. and TAIPEI, June 2, 2026
At 200 micrometers thick, an order of magnitude thinner than any micro-fan, YPlasma's DBD plasma actuator is the thinnest forced-convection cooling architecture in the industry. Following its CES 2026 noiseless laptop debut, YPlasma brings the same form factor to NVIDIA Jetson Orin Nano at COMPUTEX 2026, addressing the thermal demands of always-on Agentic AI in sealed, vibration-sensitive, and acoustically constrained edge deployments. The company is also a Top 15 Finalist of the InnoVEX 2026 Pitch Contest. On display at Booth I0601, TaiNEX 1, June 2 to 5.NEWARK, N.J. and TAIPEI, June 2, 2026 /PRNewswire/ -- YPlasma, the only company commercializing solid-state cooling based on dielectric barrier discharge (DBD) plasma actuators, today announced at COMPUTEX 2026 in Taipei the successful integration and testing of a DBD plasma cooling module on the NVIDIA Jetson Orin Nano platform. The Jetson cooling solution removes the rotary fan entirely and replaces it with a 200 micrometer flexible actuator film, 40 to 60 times thinner than the 8 to 12 mm micro-fans it replaces, that generates ionic wind to cool the device. The result is forced convection without moving parts, audible noise, vibration, or dust ingestion paths, inside a Z-height envelope that conventional rotary cooling cannot physically reach. The technology is on display throughout the show at Booth I0601, Hall 1, TaiNEX 1.
