Supermicro Introduces DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX™ Rubin NVL8, Built to Scale from 5MW to 1GW as an End-to-End Total Solution

PR Newswire

SAN JOSE, Calif. and TAIPEI, Taiwan, June 1, 2026

End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deploymentsDLC-2 Direct Liquid Cooling: engineered for near total heat capture, power efficiency, and lower noise with full stack integration of cold plates, CDUs, manifolds, rear door heat exchangers, cooling towers, and SMC PG25-A ultra-high electrical impedance coolantManagement Software Suite: End-to-end SuperCloud software delivers unified infrastructure control, deployment automation, developer tools, and multi-tenant GPU cloud managementIn-Rack, In-Row, and Site Infrastructure Solutions covering every deployment layer from rack integration to in-row CDUs and SuperCluster configurations, to site-level infrastructureDedicated Team of Supermicro Experts manage the complete deployment lifecycle: site survey, project design, integration, deployment, and ongoing supportSupporting NVIDIA's latest reference architecture integrating NVIDIA Context Memory Storage Platform, NVIDIA Spectrum™-X Ethernet, and NVIDIA Quantum-X800 InfiniBand PlatformSAN JOSE, Calif. and TAIPEI, Taiwan, June 1, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), a Total IT Solutions provider for AI, Cloud, Storage, and 5G/Edge, introduces Data Center Building Block Solutions (DCBBS) Blueprints based on the NVIDIA Vera Rubin NVL72 and the NVIDIA HGX Rubin NVL8 platforms. The Blueprints are designed for gigawatt-scale AI data center deployment, starting from building blocks of a single 1,152-GPU scalable unit that can be multiplied to virtually any size. Supermicro's DCBBS Blueprints include the design and delivery of an end-to-end total solution with a dedicated team of experts covering the full deployment lifecycle. DCBBS provide the necessary compute, storage, networking, advanced liquid cooling, power distribution, and site infrastructure, accelerating time-to-online for large-scale liquid-cooled AI Factories.