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Cadence Design Systems: Cadence rolls out AI agent to speed circuit board, chip packaging design - The Economic Times
The tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work using Cadence's existing software tools to lay out and virtually test circuit designs. Cadence said Nvidia chips will accelerate the AI work.
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forbes.com
Cadence Automates PCB Design With AI Super Agents
Cadence is rapidly deploying "Super Agents" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and advanced multi-chip packaging design.
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Cadence Expands AI Agents With AuraStack For PCB And Advanced Packaging
Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent.
