Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging
Running on Allegro AI Studio, the AuraStack AI Super Agent delivers up to 2X faster time to market, 15X higher productivity and multiphysics-driven quality across the industry's only silicon-to-system agentic AI stack
Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing. With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced packaging, through to PCB design, building on its ChipStack™, InnoStack™ and ViraStack™ AI Super Agents.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260715175854/en/ With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced packaging, through to PCB design, building on its ChipStack™, InnoStack™ and ViraStack™ AI Super Agents.
