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Cadence's AuraStack agent melds AI with HPC to speed PCB, advanced packaging design
One-two punch offers a glimpse of how low-precision AI can complement high-precision simulations
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forbes.com
Cadence Expands AI Agents With AuraStack For PCB And Advanced Packaging
Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent.
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Cadence Automates PCB Design With AI Super Agents
Cadence is rapidly deploying "Super Agents" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and advanced multi-chip packaging design.
