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China’s JCET to build new plant in Shanghai to expand advanced chip packaging

US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development.

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China’s JCET to build new plant in Shanghai to expand advanced chip packaging

US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development.

originale

cryptobriefing.com1 mese fa

JCET to build new plant in Shanghai for advanced chip packaging

JCET Group is building a massive new plant in Shanghai's Lingang area for advanced automotive and AI chip packaging, backed by a RMB 4.4 billion capital

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Timeline cronologica

giovedì 25 giugno 2026·scmp.com
China’s JCET to build new plant in Shanghai to expand advanced chip packaging
US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development.
giovedì 25 giugno 2026·cryptobriefing.com
JCET to build new plant in Shanghai for advanced chip packaging
JCET Group is building a massive new plant in Shanghai's Lingang area for advanced automotive and AI chip packaging, backed by a RMB 4.4 billion capital