Amkor Technology partners with AMD on advanced chip packaging, targeting $8.5B-$9.5B revenue by 2028 with a new Arizona campus backed by $407M in CHIPS Act funding.

Amkor Technology Expands U.S. Advanced Packaging Footprint with Additional Land in Arizona

The chipmaker is deepening partnerships with Taiwanese firms on advanced packaging to support its Helios rack-scale AI platform

Amkor Technology partners with AMD on advanced chip packaging, targeting $8.5B-$9.5B revenue by 2028 with a new Arizona campus backed by $407M in CHIPS Act funding.