Amkor Technology Expands U.S. Advanced Packaging Footprint with Additional Land in Arizona
Enables future capacity to support rising demand for Advanced packaging and test
Amkor Technology, Inc. (Nasdaq: AMKR) today reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment in its Arizona manufacturing footprint.
Located within Peoria’s Innovation Core, Amkor’s campus is being developed on a 104-acre site designed to support large-scale, leading-edge semiconductor packaging and test capabilities. As part of its long-term growth strategy, Amkor has now secured an additional 67-acre parcel adjacent to the existing campus, providing strategic flexibility to support future expansion and evolving customer demand.
This expansion builds on Amkor’s previously announced state-of-the-art Advanced packaging and test campus in Arizona. The campus is expected to be the first high-volume Advanced packaging OSAT facility in the United States, supporting the growing demand for advanced semiconductor solutions across artificial intelligence, high-performance computing, automotive, and communications markets.
