TSMC and Samsung commit to adopting ASML’s High NA EUV lithography tools by 2030

TSMC and Samsung have committed to using ASML’s High NA extreme ultraviolet (EUV) lithography technology.

Samsung said it plans to begin adoption of the technology by 2028 for production of its memory chips, while TSMC will start using the tools from 2030.

– Intel

In July, ASML announced that Intel has already started using its High NA EUV technology to manufacture its Intel Core Ultra Series 3 processors, code-named Panther Lake, built on Intel 18A process node technology.

The news comes five months after TSMC released an updated 2029 product roadmap, with the chipmaker stating at the time that all the technologies included on it would be manufactured using extreme-ultraviolet lithography (EUV) tools from ASML, instead of the most advanced high-NA EUV machines.