LG Innotek is showcasing its latest semiconductor substrate technology at KPCA show 2026 in Songdo Convensia, Incheon, this week. The company unveiled an FC-BGA for AI accelerators for the first time and said it aims to mass-produce it in 2027. It also displayed chip embedding technology, a glass substrate targeted for mass production in 2028, and Econova, a tape substrate described as the world’s first smart integrated circuit substrate without precious-metal plating.
An image of LG Innotek's showcase booth during the Korea PCB and Semiconductor Packaging Industry Association show 2026 / Courtesy of LG Innotek
LG Innotek is showcasing its latest semiconductor substrate technology this week at KPCA show 2026, a three-day industry exhibition that opened Wednesday at Songdo Convensia in Incheon.
Now in its 23rd year, the show — organized by the Korea PCB and Semiconductor Packaging Industry Association, known as KPCA — is Korea's largest trade exhibition dedicated to printed circuit boards and semiconductor packaging, drawing roughly 350 domestic and international companies.
LG Innotek's exhibit centers on FC-BGA, or flip chip-ball grid array, a high-end substrate that links semiconductor chips to a device's mainboard. The company unveiled for the first time an FC-BGA built for artificial intelligence (AI) accelerators — chips such as graphics processing units and neural processing units that handle large volumes of data at high speed. The new substrate measures more than 100 millimeters per side and required denser circuitry than standard versions. LG Innotek said it aims to begin mass production of the substrate in 2027.
