Samsung Electro-Mechanics is showcasing five next-generation semiconductor package substrates at KPCA Show 2026 in Incheon. The lineup includes 2.5D and 2.1D package substrates, glass substrates, automotive FCBGA substrates and Ultra Thin Chip Scale Package substrates. The company says the technologies target AI accelerators, servers, data centers, mobile devices and autonomous vehicles. It plans to advance large-area, multilayer and ultrafine-circuit technologies to compete in the high-end substrate market.
Samsung Electro-Mechanics showcases next-generation semiconductor package substrates at KPCA Show 2026 in Songdo, Incheon / Courtesy of Samsung Electro-Mechanics
As artificial intelligence pushes chips toward greater speed and density, Samsung Electro-Mechanics is betting that the next battleground will be beneath them, where increasingly sophisticated package substrates carry signals, power and heat.
The company is showcasing five types of next-generation semiconductor package substrates at KPCA Show 2026, which runs Wednesday through Friday at Songdo Convensia in Incheon.
The lineup includes 2.5D and 2.1D package substrates, glass substrates, automotive FCBGA substrates and Ultra Thin Chip Scale Package (UTCSP) substrates.
