ChangXin Memory Technologies, China’s most prominent domestic DRAM manufacturer, is making its most aggressive play yet in the AI hardware supply chain. CXMT has begun producing high-bandwidth memory chips, starting with HBM3 samples shipped to major clients including Huawei, with eyes on the even more advanced HBM3E standard.
The move matters because high-bandwidth memory is the bottleneck component in AI accelerators. Every major AI chip, from Nvidia’s H100 to AMD’s Instinct series, depends on HBM stacks to feed data to processors fast enough to keep up with large model training. Until now, that market has been dominated by three players: SK hynix, Samsung, and Micron.
What CXMT has actually built
CXMT began shipping HBM3 samples to clients, including Huawei, during the second half of 2025. The chips use a 16 nm process and 8-high stacks, meaning eight individual DRAM dies layered vertically and connected with through-silicon vias.
Mass production of HBM3 is targeted for the end of 2026, though analysts have flagged slippage risks. The more advanced HBM3E variant, which offers higher bandwidth and improved power efficiency, is anticipated for 2027.
