SK hynix headquarters in Icheon, Gyeonggi Province, July 29 / Yonhap
SK hynix will hold a formal groundbreaking ceremony for its new semiconductor packaging plant in the U.S. state of Indiana on Aug. 27, industry sources said Wednesday.
The Korean chipmaker has announced plans to invest $3.87 billion into its first U.S. advanced packaging and research and development (R&D) facility in West Lafayette, Indiana, to produce high bandwidth memory (HBM) chips for artificial intelligence (AI) applications.
SK hynix Chief Executive Officer (CEO) Kwak Noh-jung as well as a number of CEOs and officials from major technology companies are expected to attend the ceremony, according to the sources.
SK Group Chairman Chey Tae-won may attend the event, with speculation that Nvidia CEO Jensen Huang could also join the ceremony.
