Artificial intelligence (AI) is reshaping competition in the semiconductor industry, shifting the focus beyond transistor scaling to advanced packaging, materials and system-level integration, experts said at a Taiwan-Japan semiconductor technology forum yesterday.Taiwan Semiconductor Research Institute (TSRI) deputy director-general Tsai Hann-huei (蔡瀚輝) said advances in process-node technology were slowing while AI-driven demand for bandwidth continued to surge.“Leadership will come from system-level co- optimization, not transistor scaling alone,” Tsai said at the forum in Taipei.
Premier Cho Jung-tai, front row, fourth left, Taiwan-Japan Semiconductor Technology Association honorary chairman Kuo Jyh-huei, front row, fourth right, and other guests gesture at the Taiwan-Japan Semiconductor Technology Forum in Taipei yesterday.
Future semiconductor systems will increasingly need to combine computing, sensing, power management and connectivity for applications such as automobiles, humanoid robots, AI glasses and drones, according to his presentation.Tsai said TSRI provides a die-level heterogeneous integration and verification platform to help designers develop next-generation chip systems.
