TSMC, the company that manufactures roughly 90% of the world’s most advanced semiconductors, has confirmed it hasn’t set a specific schedule for additional investment in the United States beyond its current commitments. For a company that’s already pledged $165 billion to American soil, the largest foreign direct investment in US history, the lack of a concrete timeline for what’s next is worth paying attention to.
What TSMC has actually committed to
Here’s what’s on the table. TSMC initially pledged $65 billion to build three fabrication plants in Arizona. Then in March 2025, the company announced an additional $100 billion earmarked for three more fabs, two advanced packaging facilities, and a research and development center.
That brings the total to up to six fabrication plants on US soil. The first Arizona fab is expected to begin high-volume production by late 2024 or early 2025. The second fab’s timeline has been pushed to the second half of 2027.
The US government is sweetening the deal through the CHIPS Act, providing TSMC with $6.6 billion in direct funding and $5 billion in loans to support the Arizona projects.
