Broadcom’s wireless connectivity chips have been inside iPhones since the 3GS era, with the supplier relationship dating back to 2009. The two companies already inked a multiyear, multibillion-dollar agreement back in May 2023. That deal focused specifically on 5G radio frequency components, with a notable emphasis on US-manufactured parts. It included manufacturing commitments at facilities in locations like Fort Collins, Colorado.
Broadcom isn’t just riding the iPhone wave. The company has been diversifying aggressively into AI custom chips, with Google as a key partner for custom accelerators. Reports from December 2024 also indicate that Broadcom is collaborating with Apple on an AI server chip, codenamed Baltra, targeting production in 2026.
Apple’s in-house ambitions loom large
Apple has reportedly been aiming to reduce its reliance on third-party chip suppliers, with expectations that more in-house development would ramp up significantly around 2025.
What this means for investors
