BE Semiconductor Industries, the Dutch company that makes the machines used to assemble advanced chips, just told investors its future looks significantly bigger than it thought a year ago. Long-term revenue targets jumped from over €1 billion to a range of €1.5 to €1.9 billion, a revision so large it effectively rewrote the company’s growth thesis.
Shares responded accordingly, climbing roughly 8.4% after the announcement at the company’s Investor Day in Amsterdam on June 12, 2025.
The numbers behind the upgrade
Gross margin targets moved to 64-68%, up from a previous range of 62-66%. Operating margin expectations climbed even more dramatically, from 35-50% to 40-55%.
The catalyst is straightforward: AI data centers and photonics applications are consuming advanced packaging solutions at a pace BESI didn’t fully anticipate. Specifically, hybrid bonding, a technique that connects chiplets at the microscopic level without traditional solder bumps, has become the assembly method of choice for next-generation processors.
