BE Semiconductor Industries, the Dutch company that makes the machines used to assemble advanced chips, just told investors it expects to get a lot bigger. During its Investor Day on June 18, Besi raised its long-term revenue target to a range of €1.7 billion to €2.2 billion, up from a previous forecast of €1.5 billion to €1.9 billion.
For a company that reported €591 million in total revenue for 2025, that upper target represents roughly a 3.7x increase. The catalyst is straightforward: the AI infrastructure buildout is consuming advanced chip packaging at a pace that even optimists didn’t fully anticipate.
Hybrid bonding is the star of the show
The revenue upgrade is largely driven by surging demand for Besi’s hybrid bonding equipment, a technology that’s become essential for connecting chiplets in high-performance AI processors.
By 2026, hybrid bonding revenue alone is projected to reach approximately €476 million. That means a single product line could account for the majority of where the company’s revenue stood just a year prior.
