An image shows how a manifold microchannel cooling device directs coolant through microscopic channels inside a semiconductor chip to efficiently remove heat from high-performance processors. Coutesy of Korea Advanced Institute of Science and Technology
As artificial intelligence systems demand ever more computing power, a team of Korean researchers says it has found a way to tackle one of the industry’s most expensive and stubborn problems: heat.
Researchers at the Korea Advanced Institute of Science and Technology said Tuesday they have developed a liquid cooling technology capable of reducing the power needed for semiconductor cooling to roughly one-tenth of current levels while delivering significantly higher efficiency.
The team said the technology integrates microscopic cooling channels, thinner than a human hair, directly into semiconductor chips and combines them with a manifold structure that distributes coolant through multiple pathways.
The design is intended to shorten the distance coolant must travel, reducing energy losses while improving heat removal.
