Cerebras Systems brought its biggest flex to Singapore this week. At the SuperAI 2026 conference, the company showcased its third-generation Wafer Scale Engine, a chip containing 4 trillion transistors and 900,000 AI-optimized cores, all etched onto a single piece of silicon.
To put that transistor count in perspective: Nvidia’s H100, the current workhorse of AI data centers, contains roughly 80 billion transistors. The WSE-3 has 50 times that number.
What Cerebras actually built
The WSE-3 is fabricated on a 46,225 mm² silicon wafer using TSMC’s 5nm process technology. Where most chips are cut from wafers into individual dies, Cerebras uses the entire wafer as one massive processor.
The result is a chip that delivers 125 petaflops of peak AI performance. It also packs 44 GB of on-chip SRAM, which matters because memory bandwidth is often the real bottleneck in AI workloads, not raw compute.
