Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures.
“AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast,” said Chuck Xu, President of Interconnect Solutions at Qnity. “As architectures move from shrinking to stacking, we’re focused on enabling that shift with advanced materials that give our customers a clear edge in performance, yield, and long-term reliability. Our advanced materials and process technologies enable next-generation advanced packaging applications across wafer-level packaging, panel-level packaging, and thermal and assembly.”
Qnity’s Intervia™ 8540HSP copper is engineered for advanced packaging in AI-driven GPUs, providing a high-reliability metallization solution for micro-bump and copper redistribution layer (Cu-RDL) applications. It delivers strong within-die uniformity, tight control of surface variation, and high-purity copper deposition to support consistent, fine-pitch interconnect formation required for high-performance semiconductor devices.
