Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design
New Laird™ Tflex™ CR910 liquid gap filler and Laird™ Tgrease™ 3000 thermal grease expand Qnity’s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler, and Tgrease™ 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications.
Increasingly complex electronic architecture has made thermal management a foundational design requirement. Designers must manage increasing power densities while working with tighter tolerance and more complex assemblies—balancing performance, manufacturability, and long-term reliability under demanding, real-world conditions.
“As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry's most important engineering challenges," said Chuck Xu, President, Interconnect Solutions, Qnity. "Thermal management is no longer simply about protecting components—it's about enabling the next generation of innovation. These innovations reflect Qnity's broader commitment to delivering the technologies and engineering solutions that power progress across the semiconductor and electronics ecosystem."
