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Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh
Paras Semiconductors is set to invest ₹6,200 crore in the construction of a cutting-edge semiconductor packaging facility in Madhya Pradesh. This initiative follows the signing of a significant memorandum of understanding and aims to elevate India's semiconductor industry through advanced outsourced assembly and testing operations, catering to evolving technological demands.
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economictimes.indiatimes.com
Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh
Paras Semiconductors is set to invest ₹6,200 crore in the construction of a cutting-edge semiconductor packaging facility in Madhya Pradesh. This initiative follows the signing of…
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thehindubusinessline.com
Paras Defence's semiconductor unit to set up $644-million chip packaging facility
Paras Defence announces a $644 million investment for a semiconductor packaging facility in Madhya Pradesh, enhancing India's tech capabilities.
