Paras Defence's semiconductor unit plans to invest ₹6,200 crore ($644 million) to establish a cutting-edge chip packaging and testing facility in Madhya Pradesh.
The proposed facility will be located in Indore-Ujjain
Jul 22, 2026
12:33 pm
What's the storyParas Defence and Space Technologies has announced that its semiconductor unit will invest ₹6,200 crore to set up a chip packaging and testing facility in Madhya Pradesh.
The company's subsidiary, Paras Semiconductors, signed a memorandum of understanding with the state government's Department of Science and Technology for this project.
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Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh
Paras Defence's semiconductor unit to set up $644-million chip packaging facility
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