Tower Semiconductor will invest three billion dollars in Japan's chip manufacturing. This expansion includes one billion dollars in grants from the Japanese government. The investment will support growing AI and data center demand for advanced chips. Production of silicon photonics and silicon-germanium technology will be bolstered. Full operations are expected by the fourth quarter of 2027.

Tokyo, July 14 (Jiji Press)--Japan's industry ministry said Tuesday that it will provide up to 159 billion yen in subsidies to the Japanese unit of Israel's Tower Semiconductor…

Tower Semiconductor plans to quadruple 300mm fab capacity in Uozu, Japan, backed by METI subsidies and a joint venture restructuring with Nuvoton worth