AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor chips, each only one-fifth the thickness of a human hair. A research team successfully achieved an integration density approximately four times higher than that of commercial high-bandwidth memory (HBM) through a novel process that simultaneously transfers chips and forms metallic interconnections. The study was published in the journal Results in Engineering. The team was led by Prof. Seok Kim and integrated Ph.D. student Uhyeon Kim from the Department of Mechanical Engineering at POSTECH (Pohang University of Science and Technology), together with Dr. Hohyun Keum of the Korea Institute of Industrial Technology (KITECH).

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