Taiwan Semiconductor Manufacturing Company and Amkor Technology have inked a decade-long deal. This partnership will boost advanced chip packaging and testing capabilities within the United States. The collaboration aims to strengthen the semiconductor supply chain in Arizona. This move supports growing demand for AI and high-performance computing technologies. It ensures a more resilient US-based chip manufacturing ecosystem for customers.

TSMC and Amkor signed a 10-year deal to build advanced semiconductor packaging in Arizona, with a $7 billion facility targeting 2028 production.

Amkor (AMKR) stock surges after announcing a massive U.S. chip packaging deal with Taiwan Semiconductor. Get the full details here.

Taiwan Semiconductor Manufacturing Company and Amkor Technology have inked a decade-long deal. This partnership will boost advanced chip packaging and testing capabilities within…