TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US - The Economic Times

Taiwan Semiconductor Manufacturing Company and Amkor Technology have inked a decade-long deal. This partnership will boost advanced chip packaging and testing capabilities within the United States. The collaboration aims to strengthen the semiconductor supply chain in Arizona. This move supports growing demand for AI and high-performance computing technologies. It ensures a more resilient US-based chip manufacturing ecosystem for customers.

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