SK hynix shipped 12-layer HBM4E samples with 48GB capacity and 20% better power efficiency, accelerating its timeline ahead of 2027 mass production.

SEOUL, June 18 : SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM) chips to major customers, as the South Korean chipmaker seeks to…

SK hynix said Thursday it has shipped samples of its 12-layer HBM4E, the next generation of high-bandwidth memory for artificial intelligence, to major customer

SK hynix said Thursday it has shipped samples of high-bandwidth memory 4E (HBM4E) for next-generation artificial intelligence (AI) processors to ma...

SK hynix ha avviato la distribuzione dei primi sample di memoria HBM4E a 12 layer ai principali clienti. La nuova soluzione raggiunge 16 Gbps per pin, migliora l'efficienza…

SK Hynix shipped samples of its next-generation HBM4E AI memory chips to major customers as demand for AI infrastructure surge.

SK Hynix says it has shipped 12-layer HBM4E samples to major customers, claiming 16Gbps per pin and a 20%-plus efficiency gain.

SK hynix shipped 12-layer HBM4E samples with 48GB capacity and 20% better power efficiency, accelerating its timeline ahead of 2027 mass production.