SK hynix shipped 12-layer HBM4E samples with 48GB capacity and 20% better power efficiency, accelerating its timeline ahead of 2027 mass production.

SEOUL, June 18 : SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM) chips to major customers, as the South Korean chipmaker seeks to…

SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'